TSMC says it will have advanced ASML chipmaking tool in 2024
By Jane Lanhee Lee and Stephen Nellis
SANTA CLARA, Calif. (Reuters) – A Taiwan Semiconductor Manufacturing Co government mentioned at a convention on Thursday that the world’s largest chipmaker can have the subsequent model of ASML’s most superior lithography device in 2024.
“Wanting forward, TSMC will herald high-NA EUV scanners in 2024 to develop the related infrastructure and patterning answer wanted for patrons to gasoline innovation,” mentioned Y.J. Mii, senior vice chairman of analysis & growth, throughout TSMC’s know-how symposium in Silicon Valley.
Mii didn’t say when the machine, the second era of utmost ultraviolet lithography instruments wanted to make smaller and sooner chips, could be used for mass manufacturing. TSMC rival Intel Corp has mentioned it is going to use the machines in manufacturing by 2025 and has mentioned it might be the primary to obtain the machine.
As Intel enters into the enterprise of constructing chips that different corporations design, it is going to be competing with TSMC for these prospects. So the business is watching intently on which firm has the sting on the subsequent era of chip know-how.
Kevin Zhang, TSMC senior vice chairman of enterprise growth, later clarified that TSMC would not be prepared for manufacturing with the brand new high-NA EUV device in 2024 however that it might be principally used for analysis functions with companions.
“The significance of TSMC having it in 2024 means they get to essentially the most superior know-how sooner,” mentioned TechInsights’ chip economist Dan Hutcheson, who was on the symposium. “EUV know-how has turn into so vital to being on the forefront … high-NA EUV is the subsequent main innovation within the know-how that may put the chip know-how on the lead.”
(This story refiles to right spelling of final identify of TSMC government to Zhang, not Zhange in paragraph 5).
(Reporting by Jane Lanhee Lee in Santa Clara, California; Modifying by Mark Porter)
